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10/1 Seminar
** 尊重演講者, 請同學盡量在演講前十分鐘前就坐; 演講中,請勿進進出出. 謝謝!!
同學注意: 演講開始後才到的同學，該次不予計分 資工醫資導論 講者: 李強老師 時間: 下午1:10~2:00 地點: 資訊系館 4263 教室 (碩一,博一參加) (本週Seminar有二場, 皆為國外著名學者, 請同學注意演講時間和地點,謝謝! 請2:20或3:20分以前就坐, 謝謝!) Seminar I 講者: Department of Computer Science & Engineering, 賓州州立大學 Prof. Yuan Xie (謝源教授) 講題: Three-dimensional Integrated Circuits (3D ICs) Design, EDA, and Architecture 時間: 下午 2:30~4:00 地點: 資訊系館 4263, 4203 教室 Seminar II 講者: Department of Computer Science and Computer Engineering, La Trobe University, Australia Prof. Richard Lai 講題: A requirements engineering approach to improving IT-Business alignment 時間: 下午 3:30~5:00 地點: 資訊系館 4204 教室 --------------------------------------------------------------------------- Seminar I : Three-dimensional Integrated Circuits (3D ICs) Design, EDA, and Architecture Abstract 3D Integration emerges as an attractive option to sustain Moore's law as well as to enable More-than-Moore. This talk will present an overview of recent research progress in 3D IC designs, including both design tools perspective and architecture design perspective. It will also emphasize the following research directions for future 3D IC design: Design automation and test techniques and methodologies for 3D designs are imperative to realize 3D integration; Novel architectures and design space exploration at the architectural level are also essential to leverage 3D integration technologies for performance gain; Possible "killer" application for 3D integration (e.g., what application could dramatically benefit from 3D stacking technology or what novel applications are enabled by 3D technology.) Three-dimensional Integrated Circuits (3D ICs) Design, EDA, and Architecture Seminar II :A requirements engineering approach to improving IT-Business alignment
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